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Old 06-21-2009, 08:28 PM
Brandon Brandon is offline
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Join Date: Jun 2009
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Default Thinning a Chip?

Need some help on reducing the thickness of a off-the-shelf chip, BGA packaging.

Seems there are three steps:
1. Decap the chip (open it)
2. Die back-grind and other method to thin the chip (thin it)
3. Repackage the chip with thinned die (repackage it)

Any one has any experience can share?
Any outsouce company we can go to?
Since it is a off-the -shelf chip, we do not have the bond diagram which is needed for repackaging, how to get that?

Our goal is to reduce the 8x8x1.6mm BGA chip to 8x8x0.4mm. We do not want to damage the chip.

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