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Old 09-05-2005, 02:32 PM
Grant Stockly Grant Stockly is offline
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From: Darrell Miles : milesd-at-US.ibm.com
Date: Fri, 25 Jan 2002 11:45:46 -0500
Subject: IC package removal

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Jon,

If it is the black "plastic" (glass filled epoxy), nitric acid works on some, and sulfuric acid works on most. There are also some chemicals called "Dynasolve", that we use various types of. The differences are in the speed with which the material is removed, and what damage is done to interconnects, etc. If you watch the time you have the sample in sulfuric acid, it works for most parts.

Hope this helped.
Regards,
Darrell
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