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Old 09-05-2005, 02:27 PM
Grant Stockly Grant Stockly is offline
Join Date: Jan 2005
Posts: 447

<Part of the previous post>

Yes, hot fuming sulfuric and/or hot fuming nitric are used as standard procedures for removing plastic from IC's. The process is not quite that simple. For example, water rinses will almost certainly etch the bond pads on the IC and thus removing connection to the outside world. Additionally, the plastic contains fire retardants which some regions don't like being washed down the drain. There is more detailed help through (one of ASM's branches). B&G International sells a very safe, effective etcher which performs decapsulation automatically in minutes.

I have no association with B&G International.

David Saxon
Analytical Microscope Services
11826 Reservoir Rd. E.
Puyallup, WA 98374
253-848-7701 voice & fax
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