From: Jon Hiller : hiller-at-anl.gov
Date: Thu, 24 Jan 2002 19:26:21 -0600
Subject: IC package removal
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Does anybody have a chemical solution for removing IC packaging without
damaging the internal components? Simple grinding from the top down is not
suitable because I need all the interconnects intact. Any help in this
matter is greatly appreciated.
Sincere regards,
Jon Hiller
================================================== ================
Jon M. Hiller
Argonne National Laboratory
Materials Science Division
Electron Microscopy Center
Tel: 630-252-9558
Fax: 630-252-4798
Email: hiller-at-anl.gov
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From daemon Thu Jan 24 19:34:57 2002